Method for packaging semiconductor dice
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Alan G. Wood, Trung T. Doan, John O. Jacobson
Life of this patent
Estimating the term…
Abstract
A method for packaging a semiconductor die includes forming an additional protective layer and conductive traces on the die. The die is then placed in a multi-die holder having electrical connectors for establishing an electrical connection to the conductive traces. The protective layer is formed as a thin or thick film of an electrically insulating material such as a polymer, glass, nitride or oxide. In addition, the protective layer can be formed with a tapered peripheral edge to facilitate insertion of the die into the die holder.
Claims19
A method for packaging a semiconductor die comprising:
- providing the semiconductor die with exposed bond pads embedded in a passivation layer formed on a face of the die;
- forming conductive traces on the passivation layer in electrical contact with the exposed bond pads;
- forming a protective layer on the face of the die and over the conductive traces;
- forming vias through the protective layer to expose contact pads on the conductive traces in desired locations on the face of the die;
- providing a die holder for the die said holder including connectors for contacting the contact pads;
- and
- placing the die into the holder with the connectors in electrical contact with the contact pads.
A method for packaging semiconductor dice comprising:
- providing a plurality of semiconductor dice on a wafer each of said dice having circuitry, a passivation layer covering the circuitry and exposed bond pads in electrical communication with the circuitry;
- forming a pattern of conductive traces on the passivation layer in electrical contact with the bond pads;
- forming a protective layer over the conductive traces and circuitry, said protective layer including tapered peripheral edge;
- forming vias through the protective layer to expose contact pads on the conductive traces at desired locations on a face of the die;
- dicing the wafer to singulate the dice;
- providing a die holder for a singulated die including connectors configured to slide over the tapered peripheral edge of the protective layer and contact the exposed contact pads on the conductive traces for the singulated die;
- and
- placing the singulated die into the holder with the connectors in electrical communication with the contact pads.
A method for packaging a semiconductor die comprising:
- providing the semiconductor die with circuitry having exposed bond pads in electrical communication with semiconductor devices on the die;
- forming an additional passivation layer on the die and circuitry and forming vias through the passivation layer to the bond pads;
- forming conductive traces on the passivation layer in electrical communication with the bond pads;
- forming an electrically insulating protective layer on the conductive traces having a tapered peripheral edge;
- forming windows through the protective layer to expose contact pads on the conductive traces in a desired location on a face of the die;
- providing a die holder for the die including connectors for contacting the contact pads;
- and
- placing the die into the holder with the connectors in electrical contact with the contact pads.
Dependencies are inferred from the claim text.