Semiconductor device and semiconductor device manufacturing method

A semiconductor device manufacturing method comprising:

• mounting a first semiconductor chip on a face of a circuit board;
• sticking, to a dicing tape, a plurality of second semiconductor chips singulated in such a manner that each of the second semiconductor chips has a chip area larger than a chip area of the first semiconductor chip, each of the second semiconductor chips having a semiconductor element, at a predetermined spacing with a face having the semiconductor element facing down;
• sticking a resin film having adhesiveness on a face of each of the second semiconductor chips stuck to the dicing tape, the face of each of the second semiconductor chips being opposite to the face having the semiconductor element;
• forming a first cut having a first width larger than the predetermined spacing and a first depth on the resin film at a position corresponding to each boundary portion between the second semiconductor chips;
• forming a second cut having a width substantially equal to the predetermined spacing on the resin film remaining on a bottom of the first cut at a position overlapping the boundary portion between the second semiconductor chips when viewed in a stacking direction of the second semiconductor chip and the resin film to cut the resin film in a thickness direction;
• sticking the resin film having the first and second cuts to another dicing tape different from the dicing tape and transferring the second semiconductor chip onto the other dicing tape from the dicing tape;
• and
• sticking the resin film having the first and second cuts to the first semiconductor chip on the circuit board and transferring the second semiconductor chip onto the circuit board having the second semiconductor chip from the other dicing tape so as to mount the second semiconductor chip on the circuit board at a position overlapping the first semiconductor chip when viewed in a stacking direction of the first and second semiconductor chips, wherein
• in mounting the second semiconductor chip on the circuit board, the second semiconductor chip transferred onto the other dicing tape is picked up by a picker and mounted on the circuit board.

A semiconductor device comprising:

• a circuit board;
• a first semiconductor chip mounted on a face of the circuit board;
• a resin film covering the first semiconductor chip;
• and
• a second semiconductor chip having a chip area larger than a chip area of the first semiconductor chip, the second semiconductor chip being stuck to an upper face of the resin film and mounted on the circuit board, wherein
• the resin film entirely fits within an inner region of a bottom face of the second semiconductor chip when viewed in a stacking direction of the first and second semiconductor chips,
• the second semiconductor chip has
• a first edge extending in a first direction intersecting the stacking direction, and
• a second edge extending in a second direction intersecting the stacking direction and the first direction, the second edge being longer than the first edge, and
• the resin film has
• a first concave portion, on a side face extending along the first edge, recessed toward the inner region when viewed in the first direction, and
• a second concave portion, on the side face extending along the second edge, recessed toward the inner region when viewed in the first direction, the second concave portion being more recessed than the first concave portion toward the inner region.