High density semiconductor package

A semiconductor package comprising:

• a semiconductor die having a face with a bond pad thereon and a side;
• a first polymer film on the face and the side of the die comprising a microbump bonded to the bond pad on the die and a first contact in electrical communication with the microbump and located proximate the side of the die;
• a housing comprising a cavity configured to edge mount the die on the side;
• a substrate on the housing;
• a second polymer film on the substrate comprising a second contact configured to form a non-bonded electrical connection with the first contact on the first polymer film;
• a lid attached to the housing and a first compressible member between the lid and the die configured to bias the die against the substrate with a force;
• and
• a second compressible member between the second polymer film and the second contact configured to bias the second contact against the first contact upon application of the force.

A semiconductor package comprising:

• a substrate comprising a first polymer film and a first contact on the first polymer film;
• a first compressible member between the first polymer film and the substrate;
• a semiconductor die edge mounted to the substrate comprising a face with a bond pad thereon and a side;
• a second polymer film attached to the face and to the side of the die comprising a conductor in electrical communication with the bond pad on the die, and a second contact proximate the side of the die in electrical communication with the conductor;
• a housing mounted to the substrate comprising a cavity configured to edge mount the die on the side to the substrate, with the first contact on the substrate in non-bonded electrical communication with the second contact and biased against the second contact by the first compressible member;
• a lid attached to the housing;
• and
• a second compressible member mounted within the housing between the lid and the die, the second compressible member configured to bias the die against the substrate and to permit removal of the die.

A semiconductor package comprising:

• a substrate comprising a first polymer film and a plurality of first contacts on the first polymer film;
• a semiconductor die having a side and a face with a plurality of bond pads thereon;
• a second polymer film attached to the face and side of the die comprising a plurality of conductors in electrical communication with the bond pads, the conductors formed on opposed sides of the second polymer film, the conductors including second contacts proximate the side of the die;
• a housing attached to the substrate, the housing configured to mount the die on the side to the substrate with the first contacts on the first polymer film in electrical contact with the second contacts on the second polymer film;
• a first compressible member between the first polymer film and the substrate configured to bias the first contacts and the second contacts together;
• and
• a lid attached to the housing and a second compressible member between the lid and the die configured to bias the die and the substrate together and to permit removal and replacement of the die.

A semiconductor package comprising:

• a semiconductor die having a face with a bond pad thereon and a side;
• a polymer film attached to the face of the die, the polymer film comprising a conductor and a first contact in electrical communication with the conductor, the first contact and at least a portion of the conductor cantilevered over the side of the die and configured to exert a spring force;
• a housing configured to edge mount the die on the side;
• and
• a substrate attached to the housing comprising a second contact configured to electrically engage the first contact as the spring force biases the first contact against the second contact.

A semiconductor package comprising:

• a substrate comprising a first contact;
• a semiconductor die having a side and a face with a bond pad thereon;
• a polymer film attached to the face of the die comprising a conductor in electrical communication with the bond pad and a second contact proximate the side of the die, the second contact and at least a portion of the conductor cantilevered over the side of the die and configured to exert a spring force;
• a housing on the substrate configured to edge mount the die to the substrate with the second contact biased against the first contact by the spring force;
• and
• a lid attached to the housing and a compressible member within the housing configured to bias the die and the substrate together.