Semiconductor assembly gap filler
AssigneeMicron Technology, Inc.
InventorsJagadeesh Babu Ginjupalli, Charles Everett Siko, Darin Michael Bushey
Life of this patent
Estimating the term…
Abstract
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a printed circuit board (PCB) having a first side and a second side, an enclosure that encloses the PCB and includes one or more injection holes, and microbead foam. The first side and/or the second side of PCB may include a plurality of components. The one or more injection holes may be configured for injecting the microbead foam into a gap between the enclosure and one or more components of the plurality of components. At least a portion of the microbead foam may be located in the gap between the enclosure and the one or more components.
Claims25
A semiconductor device assembly, comprising:
- a printed circuit board (PCB) having a first side and a second side,
- wherein at least the first side of the PCB includes a plurality of components;
- an enclosure that encloses the PCB and includes one or more injection holes,
- wherein the one or more injection holes are configured for injecting a microbead foam into a gap between the enclosure and one or more components of the plurality of components;
- and
- the microbead foam,
- wherein at least a portion of the microbead foam is located in the gap between the enclosure and the one or more components.
A semiconductor package, comprising:
- a printed circuit board (PCB) comprising:
- a first exterior portion that includes at least a first component
- a first interior portion that includes at least a second component;
- a second interior portion that includes at least a third component;
- and
- a second exterior portion that includes at least a fourth component;
- an enclosure that encloses the PCB and that includes one or more injection holes,
- wherein the one or more injection holes are configured for injecting a microbead foam into one or more gaps, the one or more gaps corresponding to a first space that is between the first component and a first interior surface of the enclosure, a second space that is between the second component and the third component, a third space that is between the second component and the second interior portion or between the third component and the first interior portion, or a fourth space that is between the fourth component and a second interior surface of the enclosure;
- and
- the microbead foam,
- wherein at least a portion of the microbead foam is located in the one or more gaps.
A method, comprising:
- obtaining a semiconductor device assembly that comprises:
- a printed circuit board (PCB) having a first side and a second side,
- wherein at least the first side of the PCB includes a plurality of components;
- and
- an enclosure that encloses the PCB and includes one or more injection holes
- wherein the one or more injection holes are configured for injecting a microbead foam into a gap between the enclosure and one or more components of the plurality of components;
- and
- injecting the microbead foam into the gap between the enclosure and the one or more components after the PCB has been enclosed within the enclosure,
- wherein at least a portion of the microbead foam is located in the gap between the enclosure and the one or more components.
Dependencies are inferred from the claim text.