H10W 90/28
The stacked chips having different sizes
Official title: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
H10W90/28 (The stacked chips having different sizes) appears on 2,336 US grants and 2,974 published applications in this corpus.
Search patents in H10W- Granted patents
- 2,336
- Published applications
- 2,974
- Assignees
- 380
- Inventors
- 3,501
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 2 |
| 2002 | 7 | 13 |
| 2003 | 10 | 26 |
| 2004 | 16 | 40 |
| 2005 | 15 | 41 |
| 2006 | 20 | 55 |
| 2007 | 24 | 44 |
| 2008 | 29 | 50 |
| 2009 | 22 | 53 |
| 2010 | 52 | 51 |
| 2011 | 60 | 71 |
| 2012 | 51 | 117 |
| 2013 | 70 | 97 |
| 2014 | 98 | 129 |
| 2015 | 125 | 169 |
| 2016 | 156 | 160 |
| 2017 | 151 | 170 |
| 2018 | 163 | 154 |
| 2019 | 181 | 201 |
| 2020 | 168 | 215 |
| 2021 | 151 | 227 |
| 2022 | 178 | 227 |
| 2023 | 184 | 189 |
| 2024 | 152 | 180 |
| 2025 | 158 | 167 |
| 2026 | 67 | 126 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor structure with integrated passive device having opposed solder bumps22 Sep 2026US 12,745,672 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices15 Sep 2026US 12,737,522 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package15 Sep 2026US 12,740,491 B2Samsung Electronics Co., Ltd.
- Semiconductor package and method of manufacturing the same25 Aug 2026US 12,721,217 B2Samsung Electronics Co., Ltd.
- Three-dimensional chip stack with backside power distribution network8 Oct 2026US 2026/0314486 A1International Business Machines Corporation
- Semiconductor device and method for producing semiconductor device8 Oct 2026US 2026/0314503 A1Resonac Corporation
- Package structure1 Oct 2026US 2026/0304995 A1Ennostar Corporation
- Semiconductor package1 Oct 2026US 2026/0305413 A1LG Innotek Co., Ltd.
- System formed through package-in-package formation1 Oct 2026US 2026/0305478 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method and apparatus for generating a device ID for stacked devices631US 7,111,149 B2Intel Corporation · 2006
- Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices620US 8,877,554 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Stacked multi-chip modules and method of manufacturing346US 5,422,435 ANational Semiconductor Corporation · 1995