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US 12,745,672 B2Granted
Semiconductor structure with integrated passive device having opposed solder bumps
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFong-yuan Chang, Ho Che Yu, Yu-Hao Chen, Yii-Chian Lu, Ching-Yi Lin, Jyh Chwen Frank Lee
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Abstract
A semiconductor device includes an integrated passive device coupled to a redistribution structure by a plurality of first bumps, and having a plurality of second bumps disposed opposite the plurality of first bumps, wherein the plurality of first and second bumps are thermally and/or electrically connected, and thus enable further thermal and/or electrical connections within or comprising the semiconductor device.
Claims20
A semiconductor device, comprising:
- a redistribution structure having a first side and a second side opposite to each other;
- a first passive device disposed on the first side of the redistribution structure, wherein the first passive device comprises a plurality of first bumps and a plurality of second bumps disposed on a first side and a second side of the first passive device, respectively;
- and
- a plurality of third bumps laterally spaced from the first passive device, wherein the plurality of third bumps and the plurality of second bumps are configured to couple the semiconductor device with a package substrate at a coplanar surface of the package substrate, wherein the first passive device is configured to receive a power signal from the package substrate at the first bumps and provide a filtered instance of the power signal to a circuit disposed on the second side of the first passive device via the second bumps.
1 more element
A semiconductor device, comprising:
- a package substrate;
- a passive device physically and electrically coupled to the package substrate through a plurality of first bumps;
- a redistribution structure disposed over the passive device, wherein the passive device is physically and electrically coupled to the redistribution structure through a plurality of second bumps;
- and
- a first semiconductor chip disposed over the redistribution structure, wherein the passive device is configured to receive a power signal from the package substrate at the first bumps and provide a filtered instance of the power signal to the semiconductor chip via the second bumps.
2 more elements
Dependencies are inferred from the claim text.