Package structure

Abstract

A package structure is provided. The package structure includes a substrate, an integrated circuit, a light-emitting element, a light-receiving element, a first light-blocking part, a second light-blocking part, and an encapsulation body. The integrated circuit is disposed on the substrate. The light-emitting element is disposed on the substrate and has a light-emitting surface. The light-receiving element is disposed on the integrated circuit and has a light-receiving surface. The first light-blocking part is disposed on the integrated circuit and between the light-emitting surface of the light-emitting element and the light-receiving surface of the light-receiving element. The second light-blocking part is disposed on the first light-blocking part. The encapsulation body is disposed on the light-emitting element and the light-receiving element.

Dependencies are inferred from the claim text.