System formed through package-in-package formation
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen
Life of this patent
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Abstract
A package includes a first device die, and a second device die bonded to the first device die through hybrid bonding. The second device die is larger than the first device die. A first isolation region encapsulates the first device die therein. The first device die, the second device die, and the first isolation region form parts of a first package. A third device die is bonded to the first package through hybrid bonding. The third device die is larger than the first package. A second isolation region encapsulates the first package therein. The first package, the third device die, and the second isolation region form parts of a second package.
Claims20
A structure comprising:
- a package component comprising an inner surface and an outer surface;
- a stack of semiconductor dies disposed on the inner surface;
- and
- an interconnect structure comprising:
- a lower surface disposed on the inner surface of the package component;
- an upper surface opposite the lower surface;
- a region of dielectric material extending from the lower surface to the upper surface;
- and
- at least one conductive pillar extending from the lower surface to the upper surface, wherein the at least one conductive pillar is surrounded by the region of dielectric material, and wherein a total height of the stack of semiconductor dies is less than a height of the interconnect structure.
A structure comprising:
- a first package component;
- a die stack over the first package component, wherein the die stack comprises a plurality of dies, wherein upper dies of the plurality of dies overlap, and are electrically connected to respective lower dies of the plurality of dies, and wherein a bottommost surface of the die stack is at a lower level, and a topmost surface of the die stack is at an upper level;
- a conductive pillar over and electrically connected to the first package component, wherein the conductive pillar extends at least from the lower level to the upper level;
- and
- a dielectric region surrounding the conductive pillar.
A structure comprising:
- a die stack comprising a plurality of device dies, wherein the plurality of device dies comprise through-vias therein, and the through-vias are electrically interconnected;
- a first dielectric region comprising a first portion and a second portion on opposing sides of the die stack, wherein the first dielectric region is laterally spaced apart from the die stack;
- a first conductive pillar and a second conductive pillar in the first portion and the second portion, respectively, of the first dielectric region, wherein the die stack has a height smaller than second heights of the first conductive pillar and the second conductive pillar;
- and
- a first package component underlying and electrically connected to the plurality of device dies, and underlying and electrically connected to the first conductive pillar and the second conductive pillar.
Dependencies are inferred from the claim text.