H10W 90/297
Characterised by the through-semiconductor vias [tsvs] in the stacked chips
Official title: {characterised by the through-semiconductor vias [TSVs] in the stacked chips}
H10W90/297 (Characterised by the through-semiconductor vias [tsvs] in the stacked chips) appears on 7,846 US grants and 10,955 published applications in this corpus.
Search patents in H10W- Granted patents
- 7,846
- Published applications
- 10,955
- Assignees
- 789
- Inventors
- 9,716
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 5 | 0 |
| 1992 | 4 | 0 |
| 1993 | 9 | 0 |
| 1994 | 7 | 0 |
| 1995 | 11 | 0 |
| 1996 | 17 | 0 |
| 1997 | 24 | 0 |
| 1998 | 22 | 0 |
| 1999 | 23 | 0 |
| 2000 | 17 | 0 |
| 2001 | 36 | 22 |
| 2002 | 54 | 71 |
| 2003 | 61 | 80 |
| 2004 | 76 | 139 |
| 2005 | 68 | 125 |
| 2006 | 99 | 173 |
| 2007 | 79 | 167 |
| 2008 | 88 | 193 |
| 2009 | 123 | 221 |
| 2010 | 203 | 322 |
| 2011 | 233 | 363 |
| 2012 | 287 | 457 |
| 2013 | 365 | 420 |
| 2014 | 428 | 421 |
| 2015 | 425 | 483 |
| 2016 | 464 | 391 |
| 2017 | 425 | 367 |
| 2018 | 379 | 332 |
| 2019 | 326 | 371 |
| 2020 | 352 | 499 |
| 2021 | 420 | 676 |
| 2022 | 499 | 768 |
| 2023 | 604 | 885 |
| 2024 | 599 | 994 |
| 2025 | 589 | 1185 |
| 2026 | 413 | 830 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor memory device6 Oct 2026US 12,757,413 B2Samsung Electronics Co., Ltd.
- Semiconductor device with polymer liner and method for fabricating the same6 Oct 2026US 12,757,707 B2Nanya Technology Corporation
- Barrier layers for interconnects in bonded wafers6 Oct 2026US 12,757,721 B2United Microelectronics Corp.
- Inverted memory stack6 Oct 2026US 12,757,735 B2Advanced Micro Devices, Inc.
- Semiconductor structure and alignment method thereof6 Oct 2026US 12,757,744 B2United Microelectronics Corp.
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Hbm power up protection scheme design8 Oct 2026US 2026/0311738 A1Micron Technology, Inc.
- Rfic with substrate partition8 Oct 2026US 2026/0312551 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated chips package structure with capacitor8 Oct 2026US 2026/0313919 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structures with through via8 Oct 2026US 2026/0314366 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- System, method, and computer program product for improving memory systems1,021US 9,432,298 B1P4Tents1, LLC · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015