H10W 90/275
The stacked chips comprising dummy chips
Official title: {the stacked chips comprising dummy chips}
H10W90/275 (The stacked chips comprising dummy chips) appears on 1 US grants and 14 published applications in this corpus.
Search patents in H10W- Granted patents
- 1
- Published applications
- 14
- Assignees
- 8
- Inventors
- 37
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2023 | 0 | 1 |
| 2024 | 0 | 1 |
| 2025 | 0 | 1 |
| 2026 | 1 | 11 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package including power supply capacitor8 Oct 2026US 2026/0314504 A1Samsung Electronics Co., Ltd.
- Backside power delivery20 Aug 2026US 2026/0247967 A1
- Vertical interconnect bridges for semiconductor device assemblies20 Aug 2026US 2026/0247998 A1Micron Technology, Inc.
- Semiconductor package13 Aug 2026US 2026/0239988 A1Innolux Corporation
- Integrated circuits with thermal management layers for improved heat dissipation2 Jul 2026US 2026/0190984 A1Intel Corporation
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.