Integrated circuits with thermal management layers for improved heat dissipation

An electronic device, comprising:

• a chip package comprising one or more dies, at least one of the one or more dies comprising
• a device layer comprising one or more semiconductor devices;
• one or more interconnect layers above the device layer;
• a material layer on a top surface of a topmost interconnect layer of the one or more interconnect layers, the material layer having a thermal conductivity of at least 1.5 W/m·K;
• a bond layer over the material layer, the bond layer having a thermal conductivity of at least 1.5 W/m·K;
• and
• a substrate bonded to the bond layer.

A die, comprising:

• a device layer comprising one or more semiconductor devices;
• an interconnect region above the one or more semiconductor devices, the interconnect region comprising a plurality of interconnect layers;
• a first material layer on a top surface of a topmost interconnect layer of the plurality of interconnect layers, the first material layer having a thermal conductivity of at least 1.5 W/m·K;
• a second material layer on a top surface of the first material layer, the second material layer having a dielectric constant of less than 7.0;
• a metal layer on a top surface of the second material layer;
• and
• a substrate on the metal layer.