Semiconductor package
AssigneeInnolux Corporation
InventorsWen-Bin HUNG, Jui-Jen YUEH, Ti-Chung CHANG
Life of this patent
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Abstract
A semiconductor package is provided. The semiconductor package includes a first die, a first interconnection layer, and an encapsulation layer. The first die includes a first portion and a second portion. The first portion has a first surface and the second portion has a second surface. The first interconnection layer is disposed on the second surface. The encapsulation layer surrounds the first die and the first interconnection layer. In a cross-sectional view, the first portion has a first width at the first surface, and the second portion has a second width at the interface between the first portion and second portion. In addition, the second width is greater than the first width.
Claims20
A semiconductor package, comprising:
- a first die comprising a first portion and a second portion, wherein the first portion has a first surface and the second portion has a second surface;
- a first interconnection layer disposed on the second surface;
- and
- an encapsulation layer surrounding the first die and the first interconnection layer;
- wherein, in a cross-sectional view, the first portion has a first widt at the first surface, the second portion has a second width at an interface between the first portion and the second portion, and the second width is greater than the first width.
Dependencies are inferred from the claim text.