Vertical interconnect bridges for semiconductor device assemblies

A semiconductor package, comprising:

• a base semiconductor die electrically coupled to an interconnect structure;
• a plurality of stacked semiconductor dies that are stacked on the base semiconductor die in a first direction,
• wherein each stacked semiconductor die, of the plurality of stacked semiconductor dies, overhangs, in a second direction, at least one of the base semiconductor die or another stacked semiconductor die, forming a respective overhang portion of that semiconductor die, and
• wherein the second direction is substantially perpendicular to the first direction;
• and
• one or more vertical interconnect bridges disposed on the interconnect structure,
• wherein each vertical interconnect bridge, of the one or more vertical interconnect bridges, is electrically coupled to at least one overhang portion of at least one stacked semiconductor die and provides an electrical connection between the at least one semiconductor die and the interconnect structure.

A method, comprising:

• stacking, in a first direction, a plurality of semiconductor dies on a carrier, to form a stack of semiconductor dies,
• wherein stacking the plurality of semiconductor dies on the carrier includes stacking the plurality of semiconductor dies such that each semiconductor die, of at least a subset of the plurality of semiconductor dies, overhangs, in a second direction, at least one other semiconductor die, of the plurality of semiconductor dies, forming a respective overhang portion of that semiconductor die, and
• wherein the second direction is substantially perpendicular to the first direction;
• debonding the stack of semiconductor dies from the carrier;
• coupling one or more vertical interconnect bridges to an interconnect structure;
• and
• coupling the stack of semiconductor dies to the interconnect structure,
• wherein coupling the stack of semiconductor dies to the interconnect structure includes electrically coupling each vertical interconnect bridge, of the one or more vertical interconnect bridges, to at least one overhang portion of at least one semiconductor die.