H10W 90/22
The stacked chips being on both top and bottom sides of a
Official title: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
H10W90/22 (The stacked chips being on both top and bottom sides of a) appears on 3,022 US grants and 3,888 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,022
- Published applications
- 3,888
- Assignees
- 596
- Inventors
- 4,958
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 13 | 0 |
| 1997 | 17 | 0 |
| 1998 | 20 | 0 |
| 1999 | 26 | 0 |
| 2000 | 17 | 0 |
| 2001 | 27 | 23 |
| 2002 | 54 | 85 |
| 2003 | 50 | 81 |
| 2004 | 70 | 96 |
| 2005 | 54 | 82 |
| 2006 | 70 | 106 |
| 2007 | 77 | 114 |
| 2008 | 41 | 91 |
| 2009 | 69 | 108 |
| 2010 | 96 | 129 |
| 2011 | 110 | 108 |
| 2012 | 107 | 125 |
| 2013 | 113 | 137 |
| 2014 | 118 | 115 |
| 2015 | 118 | 150 |
| 2016 | 152 | 165 |
| 2017 | 163 | 153 |
| 2018 | 136 | 169 |
| 2019 | 168 | 160 |
| 2020 | 159 | 219 |
| 2021 | 134 | 201 |
| 2022 | 168 | 277 |
| 2023 | 182 | 250 |
| 2024 | 179 | 210 |
| 2025 | 190 | 205 |
| 2026 | 98 | 329 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Display device and method for manufacturing the same6 Oct 2026US 12,757,532 B2LG Display Co., Ltd.
- Semiconductor package and manufacturing method of semiconductor package6 Oct 2026US 12,757,758 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Stacked chip scale semiconductor device29 Sep 2026US 12,751,326 B2SanDisk Technologies LLC
- Display device15 Sep 2026US 12,740,477 B2Samsung Display Co., Ltd.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Semiconductor device and methods of manufacture8 Oct 2026US 2026/0314490 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Light-emitting diode structure and method of manufacturing the same1 Oct 2026US 2026/0305472 A1United Microelectronics Corp.
- Method for shrinking memory signal via region in accordance with predetermined memory-side ball layout to adjust control-side ball arrangement for installing control circuit at printed circuit board, and associated apparatus24 Sep 2026US 2026/0293729 A1Realtek Semiconductor Corp.
- Package structure including an embedded active die and methods for forming the same24 Sep 2026US 2026/0293758 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Transparent contacts for organic devices1,986US 5,703,436 AThe Trustees of Princeton University · 1997
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Three-dimensional multi-chip pad array carrier602US 5,222,014 AMotorola, Inc. · 1993
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998