Semiconductor device and methods of manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Chun Cho, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao
Life of this patent
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Abstract
In an embodiment, a method includes forming a conductive feature adjacent to a substrate; treating the conductive feature with a protective material, the protective material comprising an inorganic core with an organic coating around the inorganic core, the treating the conductive feature comprising forming a protective layer over the conductive feature; and forming an encapsulant around the conductive feature and the protective layer. In another embodiment, the method further includes, before forming the encapsulant, rinsing the protective layer with water. In another embodiment, the protective layer is selectively formed over the conductive feature.
Claims20
A semiconductor package comprising:
- a front-side redistribution structure;
- a semiconductor device attached to a first side of the front-side redistribution structure;
- an encapsulant over and around sidewalls of the semiconductor device;
- a through via extending through the encapsulant from the first side of the front-side redistribution structure;
- and
- an organic protective layer on sidewalls of the through via and disposed between the through via and the encapsulant.
A semiconductor package comprising:
- a first redistribution structure;
- a semiconductor device disposed over the first redistribution structure and electrically connected to the first redistribution structure;
- a second redistribution structure disposed over the semiconductor device;
- a through via disposed between and electrically connecting the first redistribution structure and the second redistribution structure;
- an adhesion layer disposed on the through via, the adhesion layer comprising an organic compound;
- and
- an encapsulant disposed between the first redistribution structure and the second redistribution structure and disposed on the adhesion layer.
A semiconductor package comprising:
- a redistribution structure;
- an encapsulant disposed over the redistribution structure;
- a through via extending through the encapsulant and electrically connected to the redistribution structure;
- and
- a plurality of particles disposed between the through via and the encapsulant, each of the plurality of particles comprising an organic material chemically bonded to an inorganic material.
Dependencies are inferred from the claim text.