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US 2026/0305472 A1Published application
Light-emitting diode structure and method of manufacturing the same
AssigneeUnited Microelectronics Corp.
InventorZHIBIAO ZHOU
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Abstract
A light-emitting diode (LED) structure is provided in the present invention, including a substrate, a dielectric layer on the substrate, metal interconnects in the dielectric layer, LED dies on the dielectric layer, wherein each LED die is provided with a front side and a back side, the back side is bonded with the dielectric layer, and the cathode and anode are on the front side of LED die, and bonding lines connecting the cathode and anode on the front side of LED die to the metal interconnects respectively.
Claims9
A method of manufacturing a light-emitting diode (LED) structure, comprising:
- providing a substrate with a first dielectric layer thereon and metal interconnects in said first dielectric layer;
- providing a LED wafer with a handle wafer and LED chips on said handle wafer;
- bonding said LED wafer onto said first dielectric layer;
- removing said handle wafer;
- performing a photolithography process to pattern said LED chips into individual LED dies, wherein each said LED die is provided with a cathode and an anode on surfaces of said LED die;
- and
- after said photolithography process, forming conductive lines connecting said cathode and said anode of each said LED die respectively to said metal interconnects.
4 more elements
Dependencies are inferred from the claim text.