Package structure including an embedded active die and methods for forming the same

A method of making a package structure, the method comprising:

• forming a package module, comprising:
• encapsulating an active die in a first encapsulant layer, wherein the active die includes a first area with a first power density and a second area with a second power density, and the first power density is greater than the second power density;
• forming an upper redistribution layer (RDL) structure on the first encapsulant layer;
• and
• attaching a dummy die to the upper RDL structure over the first area of the active die;
• attaching the package module to a package substrate;
• and
• forming a second encapsulant layer on the package substrate around the package module.

A package structure, comprising:

• a package substrate;
• a package module on the package substrate, comprising:
• a first encapsulant layer;
• a thermal via in the first encapsulant layer;
• an active die adjacent the thermal via in the first encapsulant layer,
• wherein the active die includes a first area with a first power density and a second area with a second power density, and the first power density is greater than the second power density;
• and
• a dummy die over the thermal via and the first area of the active die;
• and
• a second encapsulant layer on the package substrate around the package module.