H10W 90/271
The chips having passive surfaces facing each other, i.e. in a back-to-back
Official title: {the chips having passive surfaces facing each other, i.e. in a back-to-back arrangement}
H10W90/271 (The chips having passive surfaces facing each other, i.e. in a back-to-back) appears on 672 US grants and 776 published applications in this corpus.
Search patents in H10W- Granted patents
- 672
- Published applications
- 776
- Assignees
- 176
- Inventors
- 1,184
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 2 |
| 2002 | 5 | 5 |
| 2003 | 5 | 9 |
| 2004 | 7 | 19 |
| 2005 | 8 | 15 |
| 2006 | 11 | 20 |
| 2007 | 9 | 18 |
| 2008 | 12 | 18 |
| 2009 | 8 | 23 |
| 2010 | 21 | 25 |
| 2011 | 28 | 24 |
| 2012 | 20 | 52 |
| 2013 | 34 | 47 |
| 2014 | 41 | 36 |
| 2015 | 54 | 42 |
| 2016 | 46 | 41 |
| 2017 | 40 | 37 |
| 2018 | 42 | 36 |
| 2019 | 34 | 46 |
| 2020 | 38 | 46 |
| 2021 | 32 | 68 |
| 2022 | 49 | 54 |
| 2023 | 43 | 32 |
| 2024 | 37 | 35 |
| 2025 | 29 | 15 |
| 2026 | 12 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Three-dimensional (3D) integrated circuit (IC) (3DIC) package employing a redistribution layer (RDL) interposer facilitating semiconductor die stacking, and related fabrication methods8 Sep 2026US 12,733,542 B2QUALCOMM Incorporated
- Semiconductor package11 Aug 2026US 12,708,051 B2Samsung Electronics Co., Ltd.
- Package comprising sidewall interconnects configured for power routing11 Aug 2026US 12,708,057 B2QUALCOMM Incorporated
- Opossum redistribution frame for configurable memory devices14 Apr 2026US 12,604,747 B2Intel Corporation
- Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the same7 Apr 2026US 12,599,013 B2Intel Corporation
- Semiconductor device including mirrored die pairs20 Aug 2026US 2026/0247979 A1SanDisk Technologies LLC
- Semiconductor package13 Aug 2026US 2026/0240019 A1Samsung Electronics Co., Ltd.
- Multi-die semiconductor device with interface or control interconnections9 Jul 2026US 2026/0198281 A1QUALCOMM Incorporated
- Microelectronic device assemblies, and high-bandwidth memory packages4 Jun 2026US 2026/0157238 A1Lodestar Licensing Group LLC
- Semiconductor package21 May 2026US 2026/0144153 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Stacked semiconductor device323US 7,049,692 B2Fujitsu Limited · 2006
- Lead end grid array semiconductor package298US 5,866,939 AAmkor Technology, Inc. · 1999
- Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof266US 8,420,447 B2STATS ChipPAC, Ltd. · 2013
- Single level microelectronic device package with an integral window236US 6,661,084 B1Sandia Corporation · 2003
- Semiconductor device and method of manufacturing the same219US 6,100,594 ASharp Kabushiki Kaisha · 2000