Opossum redistribution frame for configurable memory devices

A computing device comprising:

• a communication chip;
• and
• a semiconductor package coupled to the communication chip, the semiconductor package comprising:
• a package substrate with a first surface and an opposing second surface;
• a first device coupled to the first surface of the package substrate;
• a redistribution frame coupled to the second surface of the package substrate;
• a plurality of solder balls coupled to the second surface of the package substrate;
• a second device coupled to the redistribution frame;
• and
• a printed circuit board coupled to the plurality of solder balls on the second surface of the package substrate,
• wherein the redistribution frame and the plurality of solder balls are positioned between the package substrate and the printed circuit board, wherein the redistribution frame comprises a plurality of first frame vias, wherein the plurality of first frame vias directly couple the redistribution frame to the second surface of the package substrate.

A method comprising:

• providing a package substrate with a top surface and a bottom surface;
• coupling a first device to the top surface of the package substrate;
• providing a plurality of solder balls on the bottom surface of the package substrate;
• coupling a redistribution frame to the bottom surface of the substrate;
• coupling a second device to the redistribution frame;
• and
• coupling a printed circuit board to the plurality of solder balls on the bottom surface of the package substrate,
• wherein the redistribution frame and the plurality of solder balls are positioned between the package substrate and the printed circuit board, wherein the redistribution frame comprises a plurality of first frame vias, wherein the plurality of first frame vias directly couple the redistribution frame to the second surface of the package substrate.