Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the same

A computing device comprising:

• a semiconductor package comprising:
• a package substrate;
• a base die comprising a first die surface coupled to the package substrate, and a second die surface opposite to the first die surface;
• a first device comprising a first device surface coupled to the package substrate, and a second device surface opposite to the first device surface;
• a second device comprising a third device surface coupled to the second device surface, and a fourth device surface opposite to the third device surface;
• and
• a bridge comprising a first portion and a second portion coupled to the first portion, the fourth device surface and the second die surface, wherein the first portion comprises one or more first conductive planes interposed between the package substrate and the second portion of the bridge, and coupled to a metal redistribution layer (RDL) having one or more second conductive planes in the second portion of the bridge.