Multi-die semiconductor device with interface or control interconnections

A method comprising:

• obtaining a first die coupled to an interposer, wherein the first die includes:
• a first set of external contacts on a first side of the first die and electrically coupled to the interposer;
• a first plurality of through-substrate vias (TSVs) that extend between the first side of the first die and a second side of the first die;
• and
• interface or control circuitry proximate to the first side of the first die;
• and
• electrically coupling a second die to the first die, wherein the second die includes:
• a second set of external contacts on a first side of the second die;
• a second plurality of TSVs that extend between the first side of the second die and a second side of the second die;
• and
• processor circuitry proximate to the first side of the second die and configured to access an external resource via the interface or control circuitry.

A method comprising:

• obtaining an assembly that includes a first die coupled to a second die,
• wherein the first die includes:
• a first set of external contacts on a first side of the first die;
• a first plurality of through-substrate vias (TSVs) that extend between the first side of the first die and a second side of the first die;
• and
• interface or control circuitry proximate to the first side of the first die, and
• wherein the second die includes:
• a second set of external contacts on a first side of the second die;
• a second plurality of TSVs that extend between the first side of the second die and a second side of the second die;
• and
• processor circuitry proximate to the first side of the second die and configured to access an external resource via the interface or control circuitry;
• and
• electrically coupling the second set of external contacts to a substrate.