Package comprising sidewall interconnects configured for power routing

A device comprising:

• a package comprising:
• a package substrate;
• a first integrated device coupled to the package substrate through a first plurality of bump interconnects, wherein the first plurality of bump interconnects are coupled to and touches the first integrated device and the package substrate;
• a plurality of post interconnects located at least partially in an encapsulation layer;
• a metallization portion coupled to the plurality of post interconnects;
• an encapsulation layer at least partially encapsulating the first integrated device, wherein the encapsulation layer is coupled to and touches the package substrate and the metallization portion,
• a second integrated device coupled to the metallization portion through a second plurality of bump interconnects, wherein the second plurality of bump interconnects are coupled to and touches the second integrated device and the metallization portion;
• and
• a plurality of package interconnects coupled to the encapsulation layer and the metallization portion, wherein the plurality of package interconnects are embedded in the encapsulation layer.