Semiconductor device including mirrored die pairs
AssigneeSanDisk Technologies LLC
InventorsChoong Keat Loh, Weng Khoon Mong, Huirong Zhang, Au Seong Wong
Life of this patent
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Abstract
A semiconductor device includes one or more back-to-back mirrored die pairs (BMPs). Each BMP includes first and second memory dies, joined with their respective back (inactive) surfaces bonded to each other using an adhesive. Die bond pads may be formed on exposed (active) top and bottom surfaces of the BMP. A BMP may be encapsulated in a mold compound around its edges. In order to route electrical signals between the first and second dies of a BMP, conductive columns may be formed in the mold compound around one or more of the edges of the BMP, and an RDL (redistribution layer) may be formed on the exposed top and bottom surfaces of the BMP.
Claims20
A semiconductor module, comprising:
- a first semiconductor die, comprising:
- a first active surface comprising one or more die bond pads, and
- a second inactive surface opposed to the first active surface;
- a second semiconductor die, comprising:
- a third active surface comprising one or more die bond pads, and
- a fourth inactive surface opposed to the third active surface, wherein the first and second semiconductor dies are joined with the second inactive surface of the first semiconductor die bonded to the fourth inactive surface of the second semiconductor die;
- and
- electrical connectors for electrically coupling a first die bond pad on the first active surface to a corresponding second die bond pad on the third active surface without passing through the first semiconductor die or second semiconductor die.
A semiconductor device, comprising:
- a semiconductor module, comprising:
- a first semiconductor die, comprising:
- a first active surface comprising one or more die bond pads, and
- a second inactive surface opposed to the first active surface;
- a second semiconductor die, comprising:
- a third active surface comprising one or more die bond pads, and
- a fourth inactive surface opposed to the third active surface, wherein the first and second semiconductor dies are joined with the second inactive surface of the first semiconductor die bonded to the fourth inactive surface of the second semiconductor die;
- and
- electrical connectors for electrically coupling a first die bond pad on the first active surface to a corresponding second die bond pad on the third active surface, the electrical connectors comprising conductive columns around the one or more edges of the first and second semiconductor dies;
- and
- a controller die for controlling read/write operations of the semiconductor module.
A semiconductor module, comprising:
- a first semiconductor die, comprising:
- a first active surface comprising one or more die bond pads, and
- a second inactive surface opposed to the first active surface;
- a second semiconductor die, comprising:
- a third active surface comprising one or more die bond pads, and
- a fourth inactive surface opposed to the third active surface, wherein the first and second semiconductor dies are joined with the second inactive surface of the first semiconductor die bonded to the fourth inactive surface of the second semiconductor die;
- and
- means for electrically coupling a first die bond pad on the first active surface to a corresponding second die bond pad on the third active surface without passing through the first semiconductor die or second semiconductor die.
Dependencies are inferred from the claim text.