H10W 90/291
Characterised by containers, encapsulations, or other housings for the stacked chips
Official title: {characterised by containers, encapsulations, or other housings for the stacked chips}
H10W90/291 (Characterised by containers, encapsulations, or other housings for the stacked chips) appears on 3,604 US grants and 4,638 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,604
- Published applications
- 4,638
- Assignees
- 484
- Inventors
- 5,061
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 11 | 0 |
| 1997 | 17 | 0 |
| 1998 | 26 | 0 |
| 1999 | 26 | 0 |
| 2000 | 29 | 0 |
| 2001 | 57 | 36 |
| 2002 | 78 | 116 |
| 2003 | 95 | 119 |
| 2004 | 94 | 146 |
| 2005 | 88 | 154 |
| 2006 | 103 | 180 |
| 2007 | 105 | 186 |
| 2008 | 87 | 128 |
| 2009 | 106 | 129 |
| 2010 | 125 | 121 |
| 2011 | 134 | 96 |
| 2012 | 108 | 88 |
| 2013 | 100 | 92 |
| 2014 | 73 | 94 |
| 2015 | 88 | 124 |
| 2016 | 137 | 140 |
| 2017 | 163 | 191 |
| 2018 | 171 | 197 |
| 2019 | 183 | 217 |
| 2020 | 181 | 215 |
| 2021 | 152 | 258 |
| 2022 | 212 | 332 |
| 2023 | 234 | 314 |
| 2024 | 244 | 357 |
| 2025 | 228 | 238 |
| 2026 | 120 | 370 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor storage device6 Oct 2026US 12,757,341 B2Kioxia Corporation
- Encapsulating semiconductor chips using masks6 Oct 2026US 12,757,793 B2Kioxia Corporation
- Switched-capacitor network packaged with load6 Oct 2026US RE51,058 E1pSemi Corporation
- Device, method, and system to mitigate warpage of a composite chiplet22 Sep 2026US 12,745,642 B2Intel Corporation
- Electronic package and manufacturing method thereof15 Sep 2026US 12,740,407 B2Siliconware Precision Industries Co., Ltd.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Optimized sensor fusion in deep learning accelerator with integrated random access memory1 Oct 2026US 2026/0300728 A1Micron Technology, Inc.
- Memory-only cubes and methods of forming the same1 Oct 2026US 2026/0304791 A1Micron Technology, Inc.
- Stacked semiconductor die assemblies with die support members and associated systems and methods1 Oct 2026US 2026/0305487 A1Micron Technology, Inc.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Multi-dice chip scale semiconductor components and wafer level methods of fabrication456US 6,841,883 B1Micron Technology, Inc. · 2005
- Semiconductor integrated circuit device and method of manufacturing the same437US 4,982,265 AAkita Electronics Co., Ltd. · 1991