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US 12,757,793 B2Granted
Encapsulating semiconductor chips using masks
AssigneeKioxia Corporation
InventorsSatoru Itakura, Masayuki Miura
Life of this patent
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Abstract
According to one embodiment, a method of manufacturing a semiconductor device includes placing a first semiconductor element on a wiring board, forming a first mask having an opening on the wiring board so that the first semiconductor element is positioned in the opening, putting a liquid first resin precursor into the opening of the first mask, curing the first resin precursor to obtain a first resin layer, and then removing the first mask.
Claims9
A method of manufacturing a semiconductor device, the method comprising:
- placing a first semiconductor element on a wiring board;
- forming a first mask having an opening on the wiring board so that the first semiconductor element is positioned in the opening;
- putting a liquid first resin precursor into the opening of the first mask;
- curing the first resin precursor to obtain a first resin layer;
- removing the first mask;
- placing a second semiconductor element on the first resin layer after the removing of the first mask;
- forming a second mask having an opening on the wiring board so that the first resin layer and the second semiconductor element are positioned in the opening of the second mask;
- putting a liquid second resin precursor into the opening of the second mask;
- curing the second resin precursor to obtain a second resin layer;
- removing the second mask;
- and
- connecting the second semiconductor element to the wiring board with a bonding wire, wherein
- the connecting of the second semiconductor element to the wiring board with the bonding wire occurs before the forming of the second mask.
10 more elements
Dependencies are inferred from the claim text.