Device, method, and system to mitigate warpage of a composite chiplet

A system comprising:

• a microprocessor;
• and
• a memory coupled to the microprocessor, wherein at least one of the memory or the microprocessor comprises circuitry on a composite chiplet comprising:
• a first integrated circuit (IC) component at a first level;
• a second IC component at a second level;
• a first layer of a first insulator material at the first level, wherein the first layer extends around the first IC component;
• a first conductive via which extends through the first layer and is electrically coupled to circuitry at the second level;
• and
• a first annular structure which extends through the first layer and which surrounds the first conductive via in the first layer, wherein:
• a cavity region is in the first annular structure;
• or
• the first annular structure comprises a second material, wherein a first modulus of elasticity of the first insulator material is greater than a second modulus of elasticity of the second material;
• and
• wherein:
• a contiguous body of the first insulator material of the first layer forms an entirety of a periphery of the first annular structure at the first level;
• and
• the first conductive via is an only conductive via to extend through the first annular structure.