H10W 90/293
Characterised by non-galvanic coupling between the chips
Official title: {characterised by non-galvanic coupling between the chips, e.g. capacitive coupling}
H10W90/293 (Characterised by non-galvanic coupling between the chips) appears on 1,082 US grants and 1,212 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,082
- Published applications
- 1,212
- Assignees
- 344
- Inventors
- 1,814
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 0 | 0 |
| 1997 | 8 | 0 |
| 1998 | 6 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 5 | 2 |
| 2002 | 12 | 20 |
| 2003 | 16 | 17 |
| 2004 | 22 | 26 |
| 2005 | 28 | 30 |
| 2006 | 20 | 51 |
| 2007 | 18 | 45 |
| 2008 | 26 | 43 |
| 2009 | 37 | 75 |
| 2010 | 57 | 60 |
| 2011 | 68 | 80 |
| 2012 | 67 | 52 |
| 2013 | 65 | 67 |
| 2014 | 62 | 51 |
| 2015 | 63 | 49 |
| 2016 | 67 | 39 |
| 2017 | 44 | 39 |
| 2018 | 48 | 59 |
| 2019 | 53 | 57 |
| 2020 | 52 | 48 |
| 2021 | 34 | 53 |
| 2022 | 45 | 45 |
| 2023 | 42 | 54 |
| 2024 | 31 | 63 |
| 2025 | 42 | 52 |
| 2026 | 23 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Microelectronic assemblies having integrated thin film capacitors8 Sep 2026US 12,733,499 B2Intel Corporation
- HBM silicon photonic TSV architecture for lookup computing AI accelerator18 Aug 2026US 12,713,976 B2Samsung Electronics Co., Ltd.
- High speed optical links for high-bandwidth memory systems11 Aug 2026US 12,704,690 B2Google Inc.
- Power distribution for stacked electronic devices4 Aug 2026US 12,702,064 B2Adeia Semiconductor Bonding Technologies Inc.
- Electronic device with galvanic isolation and integration methods7 Jul 2026US 12,677,427 B2Globalfoundries Singapore Pte. Ltd.
- Electronic device with galvanic isolation and integration methods1 Oct 2026US 2026/0304793 A1Globalfoundries Singapore Pte. Ltd.
- Power distribution for stacked electronic devices24 Sep 2026US 2026/0293773 A1Adeia Semiconductor Bonding Technologies Inc.
- Oio chiplet and ai computing cluster3 Sep 2026US 2026/0259384 A1Suzhou Qidian Guangzi Co., Ltd.
- Integrated electrical and optical interposer for interconnection of multiple electronic and photonic chips3 Sep 2026US 2026/0262551 A1Psiquantum, Corp.
- Semiconductor device and method for manufacturing the same27 Aug 2026US 2026/0255705 A1Sony Semiconductor Solutions Corporation
Most cited
By later US patents
- Method for making three-dimensional device391US 6,627,518 B1Seiko Epson Corporation · 2003
- Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same291US 9,461,001 B1Advanced Semiconductor Engineering, Inc. · 2016
- Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices287US 5,401,983 AGeorgia Tech Research Corporation · 1995
- System with chip to chip communication261US 5,621,913 AMicron Technology, Inc. · 1997
- Wafer-to-wafer alignments244US 7,193,423 B1International Business Machines Corporation · 2007