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US 12,713,976 B2Granted
HBM silicon photonic TSV architecture for lookup computing AI accelerator
AssigneeSamsung Electronics Co., Ltd.
InventorsPeng Gu, Krishna Malladi, Hongzhong Zheng
Life of this patent
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Abstract
According to one general aspect, an apparatus may include a memory circuit die configured to store a lookup table that converts first data to second data. The apparatus may also include a logic circuit die comprising combinatorial logic circuits configured to receive the second data. The apparatus may further include an optical via coupled between the memory circuit die and the logical circuit die and configured to transfer second data between the memory circuit die and the logic circuit die.
Claims7
An apparatus comprising:
- a first circuit die comprising a configurable logic circuit;
- a second circuit die comprising one or more logic circuits configured to transform input data to first data, wherein the input data is received at the second circuit die;
- and
- a communication path coupled between the first circuit die and the second circuit die and configured to transfer the first data between the first circuit die and the second circuit die;
- wherein the apparatus is configured to determine a performance of the configurable logic circuit, and transfer, based on the performance, the first data, using the communication path, to the first circuit die, and process the first data using the configurable logic circuit.
2 more elements
Dependencies are inferred from the claim text.