High speed optical links for high-bandwidth memory systems
AssigneeGoogle Inc.
InventorsHoria Alexandru Toma, Zuowei Shen, Ilyas Mohammed, Yingying Wang, William F. Edwards, Jr.
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Abstract
The technology generally relates to high bandwidth memory (HBM) packages and processor packages that have optical connectivity. Disclosed systems and methods herein allow for HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An HBM package can be cooled using a cooling unit that is distinct from the processor package. In addition, the cooling unit can be configured so as to provide thermal contact with a subset of high-power components within the HBM package.
Claims20
A system comprising:
- a processor package comprising one or more processing units;
- and
- a high-bandwidth memory (HBM) package comprising a plurality of HBM assemblies and one or more cooling components, wherein each HBM assembly has a first region containing a first set of components and a second region containing a second set of components, wherein the first set of components are higher power components with respect to the second set of components and the second set of components includes an optical interface configured to communicate via one or more optical fibers with the processor package, and wherein the one or more cooling components are configured to transfer heat from the first set of components of the plurality of HBM assemblies.
A system comprising:
- a processor package comprising one or more processors;
- a memory package comprising a plurality of HBM assemblies, wherein each HBM assembly comprises an HBM die and an optical interface;
- a thermal contact unit having one or more thermally conductive surfaces, wherein the HBM die of each HBM assembly is configured to contact at least one of the thermally conductive surfaces, and wherein the optical interface of each HBM assembly does not contact the one or more surfaces;
- and
- one or more optical fibers configured to optically connect the optical interface with one or more processing units.
Dependencies are inferred from the claim text.