Power distribution for stacked electronic devices
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsGuilian Gao, Gaius Gillman Fountain, JR., Belgacem Haba
Life of this patent
Estimating the term…
Abstract
A stacked electronic device is disclosed. The stacked electronic device can comprise a die stack including two or more connected dies, such as a lower die, an upper die, and a middle die between the lower die and the upper die. A plurality of through substrate vias (TSVs) can provide signal transmission to dies of the stack. A power supply path can be configured to provide power to the middle die without passing through the lower die. In some embodiments, external paths can provide power through an upper surface of a die in the stack while signals are supplied through the lower surface.
Claims20
An apparatus comprising:
- a die stack comprising at least two connected dies, the dies comprising an upper die and a lower die having an active front side and a back side, the upper die disposed over and hybrid bonded over the back side of the lower die;
- a plurality of through substrate vias (TSVs) through the lower die providing signal transmission to the upper die of the die stack;
- and
- a power supply path to provide power to the back side of the lower die, wherein the lower die comprises a power via to convey the power to devices of the lower die without passing through all metallization layers of the lower die.
An apparatus comprising:
- a lower die, wherein the lower die comprises:
- a substrate having a front side and a back side opposite the front side;
- one or more integrated devices, wherein at least portions of the one or more integrated devices are disposed nearer the front side than the back side;
- a power delivery via;
- a plurality of signal through substrate vias (TSVs);
- and
- a back-end-of-the-line (BEOL) portion having metal interconnects, wherein the BEOL portion is disposed over the front side of the substrate, wherein the power delivery via extends from at least the back side to the one or more integrated devices without extending through a thickness of the BEOL portion, wherein the plurality of signal TSVs extends at least through the BEOL portion and the substrate;
- and
- an upper die disposed over and hybrid bonded over the back side of the substrate of the lower die.
An apparatus comprising:
- a die stack comprising at least three dies, the at least three dies comprising a lower die, an upper die, and a middle die between the lower die and the upper die;
- a plurality of through substrate vias (TSVs) extending at least through the lower die and providing signal transmission to dies of the die stack;
- and
- a power distribution network below the middle die, wherein a power supply path extends from the power distribution network to provide power to the middle die without passing through the lower die.
A die stack comprising:
- a plurality of stacked dies wherein at least a bottom die of the plurality of stacked dies includes signal through substrate vias (TSVs) extending at least through a substrate portion of the bottom die;
- and
- an external power supply path providing power to at least one die of the die stack without passing through the bottom die, wherein the power is distributed to the at least one die through a power distribution network disposed below the at least one die.
Dependencies are inferred from the claim text.