Method for making three-dimensional device

A method for making a device having a plurality of layers, comprising:

• forming a cleaving layer over a first substrate;
• forming at least one layer over the cleaving layer, the at least one layer having a predetermined pattern;
• and
• transferring partly the at least one layer to a second substrate by a step including forming a cleavage of the cleaving layer so that the cleavage has the predetermined pattern, the at least one layer having a pattern corresponding to the predetermined pattern when the at least one layer is disposed over the second substrate.

A method for making a device having a plurality of layers, comprising:

• forming a cleaving layer over a first substrate;
• forming at least one layer over the cleaving layer, the at least one layer including a plurality of transistors, the at least one layer having a predetermined pattern;
• and
• transferring partly the at least one layer to a second substrate by a step including forming a cleavage of the cleaving layer so that the cleavage has the predetermined pattern, the at least one layer having a pattern corresponding to the predetermined pattern when the at least one layer is disposed above the second substrate.

A method for making an LSI, comprising:

• forming a cleaving layer over a first substrate;
• forming at least two layers over the cleaving layer, the at least two layers including a memory device and a logic device, respectively, the at least two layer having a predetermined pattern;
• and
• transferring partly the at least two layers to a second substrate by a step including forming a cleavage of the cleaving layer so that the cleavage has the predetermined pattern, the at least two layers having a pattern corresponding to the predetermined pattern when the at least two layers are disposed over the second substrate.

A method for making a device having a plurality of layers including at least one device layer where a device is disposed, comprising:

• forming a cleaving layer over a first substrate;
• forming at least one layer over the cleaving layer, the at least one layer having a predetermined pattern;
• and
• transferring partly the at least one layer to the second substrate so that the at least one layer has the predetermined pattern when the at least one layer is disposed over the second substrate.

A method for making a device having a plurality of layers, comprising:

• forming a cleaving layer having a predetermined pattern on a first substrate;
• forming at least one layer on the cleaving layer, the at least one layer having the predetermined pattern;
• and
• transferring the at least one layer to a second substrate by a step including forming a cleavage of the cleaving layer so that the at least one layer has a pattern corresponding to the predetermined pattern when the at least one layer is disposed over the second substrate.

A method for making a device having a plurality of layers, comprising:

• forming a cleaving layer on a first substrate;
• forming at least one layer on the cleaving layer, the at least one layer having a predetermined pattern;
• and
• transferring partly the at least one layer to a second substrate by a step including irradiating the cleaving layer with a light through a mask having the predetermined pattern.

A method for making a device having a plurality of layers, comprising:

• forming a cleaving layer over a first substrate;
• forming at least one layer over the cleaving layer;
• etching the cleaving layer to have a predetermined pattern;
• and
• transferring the at least one layer to a second substrate, the at least one layer having a pattern corresponding to the predetermined pattern when the at least one layer is deposited over the second substrate.