H10W 90/295
Optical coupling
Official title: {optical coupling}
H10W90/295 (Optical coupling) appears on 150 US grants and 214 published applications in this corpus.
Search patents in H10W- Granted patents
- 150
- Published applications
- 214
- Assignees
- 74
- Inventors
- 334
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 0 | 2 |
| 2005 | 3 | 1 |
| 2006 | 2 | 13 |
| 2007 | 1 | 6 |
| 2008 | 0 | 2 |
| 2009 | 2 | 4 |
| 2010 | 3 | 5 |
| 2011 | 20 | 11 |
| 2012 | 5 | 4 |
| 2013 | 4 | 6 |
| 2014 | 4 | 4 |
| 2015 | 5 | 7 |
| 2016 | 15 | 8 |
| 2017 | 4 | 4 |
| 2018 | 6 | 7 |
| 2019 | 6 | 16 |
| 2020 | 11 | 8 |
| 2021 | 7 | 14 |
| 2022 | 14 | 15 |
| 2023 | 10 | 11 |
| 2024 | 2 | 20 |
| 2025 | 15 | 32 |
| 2026 | 10 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- High speed optical links for high-bandwidth memory systems11 Aug 2026US 12,704,690 B2Google Inc.
- Packaging optical components in a circuit package9 Jun 2026US 12,650,563 B2Celestial Al Inc.
- Package structure2 Jun 2026US 12,645,041 B2Unimicron Technology Corp.
- Method of making semiconductor device including optical through via and method of using28 Apr 2026US 12,613,382 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Oio chiplet and ai computing cluster3 Sep 2026US 2026/0259384 A1Suzhou Qidian Guangzi Co., Ltd.
- Integrated electrical and optical interposer for interconnection of multiple electronic and photonic chips3 Sep 2026US 2026/0262551 A1Psiquantum, Corp.
- Interface between electronic integrated circuit and photonic integrated circuit30 Jul 2026US 2026/0223736 A1Avago Technologies International Sales Pte. Limited
- Heterogenous Photonic Integration23 Jul 2026US 2026/0211271 A1Massachusetts Institute of Technology
- Cryogenic die to die electrical connectors2 Jul 2026US 2026/0191119 A1Psiquantum, Corp.
Most cited
By later US patents
- Terahertz interconnect system and applications220US 6,967,347 B2The Regents of the University of Colorado · 2005
- Three-dimensional optical-electronic integrated circuit device with raised sections111US 5,357,122 ASony Corporation · 1994
- Coaxial through chip connection98US 7,157,372 B1Cubic Wafer, Inc. · 2007
- Integrated electrical/optical interface with two-tiered packaging62US 11,107,770 B1Xilinx, Inc. · 2021
- Three-dimensional memory module architectures60US 8,059,443 B2Hewlett-Packard Development Company, L. P. · 2011