Interface between electronic integrated circuit and photonic integrated circuit

A method of fabricating an integrated circuit (IC) assembly, comprising:

• coupling a first electrical integrated circuit (EIC) electrically and mechanically to a substrate, the first EIC including a first and a second die-to-die interface circuit;
• coupling a first optical transceiver engine electrically and mechanically to the substrate, the first optical transceiver engine including a third and a fourth die-to-die interface circuit;
• coupling a second optical transceiver engine electrically and mechanically to the substrate, the second optical transceiver engine including a fifth and a sixth die-to-die interface circuit;
• coupling the third die-to-die interface circuit electrically to the first die-to-die interface circuit by first conductors of the substrate;
• coupling the fifth die-to-die interface circuit electrically to the second die-to-die interface circuit by second conductors of the substrate;
• configuring the fourth and the sixth die-to-die interface circuits as disconnected from power supplies of the first and second optical transceiver engines, respectively.

An apparatus, comprising:

• first and second optical connectors;
• and
• an integrated circuit (IC) assembly, the IC assembly comprising:
• a first electrical integrated circuit (EIC) electrically and mechanically coupled to a substrate, the first EIC including a first and a second die-to-die interface circuit;
• a first optical transceiver engine electrically and mechanically coupled to the substrate, the first optical transceiver engine including a third and a fourth die-to-die interface circuit, the first optical transceiver engine coupled to the first optical connector;
• a second optical transceiver engine electrically and mechanically coupled to the substrate, the second optical transceiver engine including a fifth and a sixth die-to-die interface circuit, the second optical transceiver engine coupled to the second optical connector;
• the third die-to-die interface circuit electrically coupled to the first die-to-die interface circuit by first conductors of the substrate;
• the fifth die-to-die interface circuit electrically coupled to the second die-to-die interface circuit by second conductors of the substrate;
• the fourth and the sixth die-to-die interface circuits being configured as disconnected from power supplies of the first and second optical transceiver engines, respectively.