US 12,650,563 B2 · Packaging optical components in a circuit package

Abstract

The present disclosure relates to example implementations of optically accessible circuit packages. For example, this disclosure includes implementations for creating a circuit package with a photonic integrated circuit (PIC) connected to electrical integrated circuit (EIC) components via an organic interposer. In many implementations, the circuit package maintains optical access to a gating coupler (GC) region on the PIC via an internal cavity area in the organic interposer. In this way, a fiber array unit (FAU) or other optical connection can couple to the circuit package to communicate data from the EIC components of the circuit package and another circuit package or an external device connected to the FAU (e.g., both send and receive data with the cp) via the open access GC region.

Claims30

Dependent claims

A circuit package, comprising:

an organic interposer having a top surface and a bottom surface, wherein the organic interposer includes:
an internal cavity area defining a hole in the organic interposer extending through the organic interposer from the top surface to the bottom surface;
and
a dam wall that rises above the top surface of the organic interposer and surrounds the internal cavity area;
a photonic integrated circuit (PIC) positioned above the top surface of the organic interposer and attached to the organic interposer with electrical connections, wherein a photonically sensitive area of the PIC is located directly above the internal cavity area of the organic interposer;
and
an underfill material between the PIC and the organic interposer, wherein the underfill material is absent in the internal cavity area.

4 more elements

A circuit package, comprising:

a removable mechanical base;
an organic interposer having a top surface and a bottom surface, the bottom surface attached over the removable mechanical base with a debonding material, wherein the organic interposer includes:
an internal cavity area defining a hole in the organic interposer extending through the organic interposer from the top surface to the bottom surface;
and
a dam wall that rises above the top surface of the organic interposer and surrounds the internal cavity area;
a photonic integrated circuit (PIC) positioned above the top surface of the organic interposer and attached to the organic interposer with electrical connections, wherein a photonically sensitive area of the PIC is located directly above the internal cavity area of the organic interposer;
an underfill material between the PIC and the organic interposer, wherein the underfill material is absent in the internal cavity area;
and
an electronic integrated circuit component (EIC component) attached to the PIC via the organic interposer, wherein the EIC component is offset from the internal cavity area of the organic interposer.

6 more elements

Dependencies are inferred from the claim text.

Packaging optical components in a circuit package

Life of this patent

Packaging optical components in a circuit package

Life of this patent

Abstract

Claims30