Package structure

A package structure, comprising:

• a circuit board;
• a co-packaged optics substrate, configured on the circuit board and electrically connected to the circuit board;
• an application specific integrated circuit assembly, configured on the co-packaged optics substrate and electrically connected to the co-packaged optics substrate;
• a glass interposer, configured on the co-packaged optics substrate and electrically connected to the co-packaged optics substrate, wherein the glass interposer comprises an upper surface and a lower surface opposite to each other, a cavity extending from the lower surface toward the upper surface, and at least one through glass via penetrating the glass interposer and connecting the upper surface and the lower surface;
• an electronic integrated circuit assembly, configured on the upper surface of the glass interposer and electrically connected to the glass interposer;
• a photonic integrated circuit assembly, configured in the cavity of the glass interposer and electrically connected to the glass interposer;
• and
• an optical fiber assembly, configured on the lower surface of the glass interposer and optically connected to the photonic integrated circuit assembly.