Three-dimensional optical-electronic integrated circuit device with raised sections

The optical-electronic integrated circuit device, comprising:

• an optical interconnection base plate having a plurality of raised sections, said plurality of raised sections having sidewalls and defining a groove between said raised sections, said sidewalls of said raised sections having an inclined surface;
• semiconductor substrates on said plurality of raised sections, said semiconductor substrates are stacked in a direction perpendicular to the major surface of said semiconductor substrates;
• at least one light emitting element on one of said semiconductor substrates operable to emit optical signals;
• a light receiving element on another of said semiconductor substrates;
• an optical interconnection base plate arranged parallel to said semiconductor substrates;
• a reflecting film on said inclined surface provided facing said light emitting element to reflect the optical signals emitted by said at least one light emitting element;
• and
• a light waveguide channel through which the optical signals are transmitted before being reflected by said reflective film on said inclined surface provided facing said light receiving element so as to be incident on said light-receiving element;
• wherein the optical signals transmitted between said at least one light emitting element on said one of said semiconductor substrates and said light receiving element on said another semiconductor substrate being coupled through said groove between said raised sections,
• wherein said optical interconnection base plate is formed of silicon, and
• wherein said light waveguide channel is formed by a silicon oxide film formed on said optical interconnection base plate.

The optical-electronic integrated circuit device, comprising:

• an optical interconnection base plate having a plurality of raised sections, said plurality of raised sections having sidewalls and defining a groove between said raised sections, said sidewalls of said raised sections having an inclined surface;
• semiconductor substrates on said plurality of raised sections, said semiconductor substrates are stacked in a direction perpendicular to the major surface of said semiconductor substrates;
• at least one light emitting element on one of said semiconductor substrates operable to emit optical signals;
• a light receiving element on another of said semiconductor substrates;
• an optical interconnection base plate arranged parallel to said semiconductor substrates;
• a reflecting film on said inclined surface provided facing said light emitting element to reflect the optical signals emitted by said at least one light emitting element;
• and
• a light waveguide channel through which the optical signals are transmitted before being reflected by said reflective film on said inclined surface provided facing said light receiving element so as to be incident on said light-receiving element;
• wherein the optical signals transmitted between said at least one light emitting element on said one of said semiconductor substrates and said light receiving element on said another semiconductor substrate being coupled through said groove between said raised sections,
• wherein said light wave guide channels are formed in a region of a silicon oxide film having a refractive index that is higher than a refractive index of material surrounding said region.

The optical-electronic integrated circuit device, comprising:

• an optical interconnection base plate having a plurality of raised sections, said plurality of raised sections having sidewalls and defining a groove between said raised sections, said sidewalls of said raised sections having an inclined surface;
• semiconductor substrates on said plurality of raised sections, said semiconductor substrates are stacked in a direction perpendicular to the major surface of said semiconductor substrates;
• at least one light emitting element on one of said semiconductor substrates operable to emit optical signals;
• a light receiving element on another of said semiconductor substrates;
• an optical interconnection base plate arranged parallel to said semiconductor substrates;
• a reflecting film on said inclined surface provided facing said light emitting element to reflect the optical signals emitted by said at least one light emitting element;
• and
• a light waveguide channel through which the optical signals are transmitted before being reflected by said reflective film on said inclined surface provided facing said light receiving element so as to be incident on said light-receiving element;
• wherein the optical signals transmitted between said at least one light emitting element on said one of said semiconductor substrates and said light receiving element on said another semiconductor substrate being coupled through said groove between said raised sections,
• wherein said optical interconnection base plate is formed of silicon, said inclined surface is formed by sidewall surfaces of raised sections formed on said semiconductor substrates, and
• wherein said light waveguide channels are formed in a silicon oxide film formed in a region defined between said raised sections.