Oio chiplet and ai computing cluster
AssigneeSuzhou Qidian Guangzi Co., Ltd.
InventorsChongjin Xie, Miaofeng Li, Jun Zhou
Life of this patent
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Abstract
Disclosed are an OIO chiplet and an AI computing cluster, applied in the technical field of optoelectronic transmission, where the OIO chiplet includes photonic chips, electronic chips, and a microcontroller chip, or a microcontroller application-specific integrated circuit. The photonic chip, the electronic chip, and control units are packaged into a single OIO chiplet, and the chiplet operates independently as an OIO. Analog optical and electrical equalization technologies are applied in the photonic chip and the electronic chip to enhance system bandwidth and linearity. The chiplet is applied to a Scale-up network inside the node for interconnects among GPUs.
Claims13
An OIO chiplet, comprising:
- photonic chips, wherein the photonic chip comprises photodetectors and photonic modulators, the photodetector is configured to receive an optical signal, the photonic modulator modulates an input continuous-wave light according to an input electrical signal and outputs the optical signal, and the photonic modulator improves bandwidth through analog equalization;
- electronic chips, wherein the electronic chip comprises driver amplifiers, transimpedance amplifiers, and application-specific integrated circuits, the driver amplifier provides a driving signal for the photonic modulator, the transimpedance amplifier amplifies an electrical signal generated by the photodetector, and the application-specific integrated circuit comprises an analog equalization module configured to improve linearity of the driver amplifier and the transimpedance amplifier;
- a microcontroller chip, wherein the microcontroller chip is connected to feedback terminals of the photodetector and the photonic modulator, and sends control signals to the photodetector and the photonic modulator to adjust output;
- and
- an interposer, wherein the photonic chip, the electronic chip, and the microcontroller chip are stacked on the interposer in a form of bare die, and inter-chip communication is implemented using through-silicon vias or through-mold vias.
An OIO chiplet, comprising:
- photonic chips, wherein the photonic chip comprises photodetectors and photonic modulators, the photodetector is configured to receive an optical signal, the photonic modulator modulates an input continuous-wave light according to an input electrical signal and outputs the optical signal, and the photonic modulator improves bandwidth through analog equalization;
- electronic chips, wherein the electronic chip comprises driver amplifiers, transimpedance amplifiers, and application-specific integrated circuits, the driver amplifier provides a driving signal for the photonic modulator, the transimpedance amplifier amplifies an electrical signal generated by the photodetector, and the application-specific integrated circuit comprises a microcontrol circuit and an analog equalization module configured to improve linearity of the driver amplifier and the transimpedance amplifier, wherein the microcontrol circuit is connected to feedback terminals of the photodetector and the photonic modulator, and sends control signals to the photodetector and the photonic modulator to adjust output;
- and
- an interposer, wherein the photonic chip and the electronic chip are stacked on the interposer in a form of bare die, and inter-chip communication is implemented using through-silicon vias or through-mold vias.
Dependencies are inferred from the claim text.