Method of making semiconductor device including optical through via and method of using

A method of using a semiconductor device comprising:

• receiving an optical signal in a waveguide on a first side of a substrate, wherein the substrate comprises a semiconductor material;
• propagating the optical signal through the substrate using an optical through via (OTV) extending through the substrate;
• deflecting the optical signal using a beam deflector toward a photonic element on a second side of the substrate, wherein deflecting the optical signal comprises:
• receiving at least one voltage signal;
• and
• adjusting a deflection angle of the beam deflector in response to the at least one voltage signal having a first voltage.

A method of using a semiconductor device comprising:

• receiving an optical signal in a waveguide on a first side of a substrate, wherein the substrate comprises a semiconductor material;
• deflecting the optical signal into an optical through via (OTV) using a first beam deflector on the first side of the substrate, wherein the OTV extends through the substrate from the first side of the substrate to a second side of the substrate, wherein deflecting the optical signal into the OTV comprises:
• controlling a first angle of deflection of the first beam deflector using a first control element;
• and
• deflecting the optical signal on the second side of the substrate using a second beam deflector.