US 5,401,983 A · Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices

Abstract

Various novel lift-off and bonding processes (60, 80, 100) permit lift-off of thin film materials and devices (68), comprising In.sub.x Ga.sub.1-x As.sub.y P.sub.1-y where 0<x<1, and 0<y<1, from a growth substrate (62) and then subsequent alignable bonding of the same to a host substrate (84). As a result, high quality communication devices can be fabricated for implementing a three dimensional electromagnetic communication network within a three dimensional integrated circuit cube (10), an array (90) of optical detectors (98) for processing images at very high speed, and a micromechanical device (110) having a platform (114) for steering or sensing electromagnetic radiation or light.

Claims35

Dependent claims

A micromechanical device for providing efficient steerable optical coupling with integrated circuitry, comprising:

a movable platform supported by legs on a substrate, said substrate having a substrate electrode, said platform having a bottom electrode, and wherein said platform is moved by applying a first electrical source between said substrate electrode and said bottom electrode;
and
a photonic device residing on said platform and movable therewith, said photonic device being created on a growth substrate remote from said movable platform and subsequently bonded to said movable platform, said photonic device having a top electrode thereon, said photonic device serving as a light interface when a second electrical source is applied between said top electrode and said bottom electrode.

Dependencies are inferred from the claim text.

Facts

Application

08/044,251Filed 7 Apr 1993 · continuation in part

Priority

8 Apr 1992

Granted

28 Mar 1995

Term ends

Not estimatedThe source records don’t support an estimate.

Classification20 codes

H01S 5/183
Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities: having only vertical cavities, e.g. vertical cavity…
B81C 1/00373
Creating layers of material on a substrate: selective deposition, e.g. printing or microcontact printing
H10F 39/021
Manufacture or treatment of image sensors covered by group H10F39/12: of image sensors having active layers comprising only Group III-V materials,…
H10F 39/026
Manufacture or treatment of image sensors covered by group H10F39/12: wafer-level processing

Family

Serial865,379Parent of this continuation-in-part · filed 8 Apr 1992

Serial865,126Parent of this continuation-in-part · filed 8 Apr 1992

US 5,280,184 AParent of this continuation-in-part

US 5,244,818 AParent of this continuation-in-part

US 5,401,983 AThis patent

From the US filing history. Foreign family members aren’t listed.

Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices

Life of this patent

Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices

Life of this patent

Abstract

Claims35