Power distribution for stacked electronic devices
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsGuilian Gao, Gaius Gillman Fountain, Jr., Belgacem Haba
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Abstract
A stacked electronic device is disclosed. The stacked electronic device can comprise a die stack including two or more connected dies, such as a lower die, an upper die, and a middle die between the lower die and the upper die. A plurality of through substrate vias (TSVs) can provide signal transmission to dies of the stack. A power supply path can be configured to provide power to the middle die without passing through the lower die. In some embodiments, external paths can provide power through an upper surface of a die in the stack while signals are supplied through the lower surface.
Claims20
An apparatus comprising:
- a die stack comprising at least three connected dies, the at least three connected dies comprising a lower die, an upper die, and a middle die between the lower die and the upper die, wherein the at least three connected dies of the die stack are hybrid bonded to one another, wherein a hybrid bonded interface between two dies of the at least three connected dies comprises conductor-to-conductor direct bonds and dielectric-to-dielectric direct bonds;
- a plurality of through substrate vias (TSVs) extending at least through the lower die and providing signal transmission to dies of the die stack;
- and
- a power supply path configured to provide power to the middle die without passing through the lower die.
An apparatus comprising:
- a plurality of stacked dies including signal through substrate vias (TSVs) extending through a lowest die in the plurality of stacked dies;
- and
- a bond wire or an edge trace to provide power to one or more dies above the lowest die and below a highest die in the plurality of stacked dies without passing through the lowest die,
- wherein the lowest die is hybrid bonded to the one or more dies, and wherein the one or more dies are hybrid bonded to one another, wherein a hybrid bonded interface between the lowest die and the one or more dies comprises conductor-to-conductor direct bonds and dielectric-to-dielectric direct bonds.
A die stack comprising:
- a plurality of stacked dies wherein at least a bottom die of the plurality of stacked dies includes signal through substrate vias (TSVs) extending at least through a substrate portion of the bottom die;
- and
- an external power supply path providing power to at least one die of the die stack without passing through the bottom die, wherein the at least one die comprises a middle die,
- wherein the plurality of stacked dies are connected to one another by direct hybrid bonding, and wherein a hybrid bonded interface between two dies of the plurality of stacked dies comprises conductor-to-conductor direct bonds and dielectric-to-dielectric direct bonds.
Dependencies are inferred from the claim text.