H10W 90/10
Configurations of laterally-adjacent chips
H10W90/10 (Configurations of laterally-adjacent chips) appears on 1,900 US grants and 2,728 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,900
- Published applications
- 2,728
- Assignees
- 519
- Inventors
- 3,847
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 6 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 8 | 0 |
| 1993 | 3 | 0 |
| 1994 | 8 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 11 | 0 |
| 2000 | 10 | 0 |
| 2001 | 5 | 3 |
| 2002 | 11 | 14 |
| 2003 | 11 | 22 |
| 2004 | 19 | 27 |
| 2005 | 22 | 42 |
| 2006 | 22 | 23 |
| 2007 | 19 | 34 |
| 2008 | 17 | 54 |
| 2009 | 21 | 45 |
| 2010 | 42 | 67 |
| 2011 | 48 | 52 |
| 2012 | 47 | 52 |
| 2013 | 54 | 52 |
| 2014 | 67 | 82 |
| 2015 | 89 | 135 |
| 2016 | 84 | 102 |
| 2017 | 128 | 133 |
| 2018 | 126 | 149 |
| 2019 | 176 | 164 |
| 2020 | 140 | 196 |
| 2021 | 153 | 167 |
| 2022 | 123 | 164 |
| 2023 | 120 | 117 |
| 2024 | 110 | 129 |
| 2025 | 102 | 151 |
| 2026 | 54 | 552 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor package and semiconductor package assembly with edge side interconnection29 Sep 2026US 12,751,308 B2Etron Technology, Inc.
- Non-volatile programmable logic device based on multi-chip package15 Sep 2026US 12,737,520 B2iCometrue Company Ltd.
- Semiconductor devices and methods of manufacturing semiconductor devices15 Sep 2026US 12,740,473 B2Amkor Technology Singapore Holding Pte.Ltd.
- Package with integrated voltage regulator and method forming the same1 Sep 2026US 12,727,177 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Light-emitting diode package structure and manufacturing method thereof25 Aug 2026US 12,720,938 B2E Ink Holdings Inc.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- System-in-package (sip) configured to receive multiple memory dies8 Oct 2026US 2026/0314443 A1QUALCOMM Incorporated
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
Most cited
By later US patents
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Multichip integrated circuit modules586US 5,250,843 AIntegrated System Assemblies Corporation · 1993
- Wafer-level packaging mechanisms585US 8,703,542 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Single chip modules, repairable multichip modules, and methods of fabrication thereof552US 5,841,193 AEPIC Technologies, Inc. · 1998