H10W 90/155
The laterally-adjacent chips comprising dummy chips
Official title: {the laterally-adjacent chips comprising dummy chips}
H10W90/155 (The laterally-adjacent chips comprising dummy chips) appears on 2 US grants and 17 published applications in this corpus.
Search patents in H10W- Granted patents
- 2
- Published applications
- 17
- Assignees
- 6
- Inventors
- 70
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2022 | 0 | 2 |
| 2023 | 0 | 1 |
| 2024 | 0 | 3 |
| 2025 | 1 | 5 |
| 2026 | 1 | 6 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Structures and processes for attaching cold plates to multi chip modules1 Oct 2026US 2026/0305336 A1
- One or more stacked memory devices and a semiconductor system11 Jun 2026US 2026/0165213 A1SK hynix Inc.
- Stacked memory devices and semiconductor system4 Jun 2026US 2026/0157239 A1SK hynix Inc.
- Semiconductor device and methods of formation7 May 2026US 2026/0130279 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated fan-out package and manufacturing method thereof30 Apr 2026US 2026/0123529 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.