Transparent package for use with printed circuit boards
AssigneeHoneywell Federal Manufacturing & Technologies, LLC
InventorLouis Diamond
Life of this patent
Estimating the term…
Abstract
A blank package for mimicking an electronic component package comprises a body and a plurality of conductive pads. The body is formed from generally transparent electrically insulating material and has a top surface, a bottom surface, and a plurality of side surfaces. The bottom surface has a shape and dimensions that are similar to a bottom surface of the electronic component package. The conductive pads are formed from electrically conductive material and attached to the body, with each conductive pad corresponding to a successive one of the conductive pads of the electronic component package. Each conductive pad has features that are similar to features of the corresponding conductive pad of the electronic component package.
Claims13
A package for mimicking an electronic component package that includes a plurality of leads, the package comprising:
- a body formed from electrically insulating material that is transparent to visible light, the body having a top surface, a bottom surface, and a plurality of side surfaces;
- a plurality of conductive pads formed from electrically conductive material and positioned on one or more of the surface(s);
- a plurality of solder pads formed from solder, each solder pad positioned on and connected to a respective one of the conductive pads;
- and
- a plurality of leads formed from electrically conductive material, each lead corresponding to a respective one of the leads of the electronic component package, being positioned in a location corresponding to a location of a corresponding one of the leads of the electronic component package, and attached only to a respective one of the solder pads.
A method of forming a package for mimicking an electronic component package that includes a plurality of leads, the method comprising:
- forming a body of the package, the body formed from electrically insulating material that is transparent to visible light, the body having a top surface, a bottom surface, and a plurality of side surfaces;
- forming a plurality of conductive pads on one or more surface(s) of the body, each conductive pad formed from electrically conductive material;
- forming a respective one of a plurality of solder pads on each of the conductive pads, each solder pad formed from solder;
- and
- attaching a respective one of a plurality of leads to each of the solder pads, each lead corresponding to a respective one of the leads of the electronic component package, being positioned in a location corresponding to a location of a corresponding one of the leads of the electronic component package, and attached only to a respective one of the solder pads.
Dependencies are inferred from the claim text.