H10W 90/15
The laterally-adjacent chips having different thicknesses than each other
Official title: the laterally-adjacent chips having different thicknesses than each other
H10W90/15 (The laterally-adjacent chips having different thicknesses than each other) appears on 3 US grants and 29 published applications in this corpus.
Search patents in H10W- Granted patents
- 3
- Published applications
- 29
- Assignees
- 21
- Inventors
- 89
- Latest grant
- 7 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 1 |
| 2024 | 1 | 5 |
| 2025 | 1 | 2 |
| 2026 | 0 | 19 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device package7 Oct 2025US 12,438,128 B2Advanced Semiconductor Engineering, Inc.
- Semiconductor device package and method of manufacturing the same30 Jan 2024US 11,887,967 B2Advanced Semiconductor Engineering, Inc.
- Semiconductor device package and method of manufacturing the same5 Oct 2021US 11,139,274 B2Advanced Semiconductor Engineering, Inc.
- High bandwidth memory system, method and device17 Sep 2026US 2026/0282394 A1Marvell Asia Pte Ltd
- Package structure and method for forming the same17 Sep 2026US 2026/0282959 A1JCET Microelectronics (Jiangyin) Co., LTD.
- Component carrier and method for manufacturing a component carrier10 Sep 2026US 2026/0271758 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Package device20 Aug 2026US 2026/0248006 A1Bridge Semiconductor Corporation
- Side-by-side integrated device package with wirebond interconnects30 Jul 2026US 2026/0223735 A1QUALCOMM Incorporated
Most cited
By later US patents