US 2026/0282959 A1 · PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Abstract

A package structure and a method for forming the same are provided. The package structure includes: an interposer including a first main surface and a second main surface opposed to the first main surface along a first direction; a first chip on the first main surface, and the first chip is electrically connected to the interposer; a storage structure on the first main surface, and the storage structure is electrically connected to the interposer, and the storage structure and the first chip are arranged along a second direction; and a second chip on the second main surface, and the second chip is electrically connected to the interposer, and a projection of the second chip on the second main surface covers a projection of the first chip on the second main surface and a projection of the storage structure on the second main surface.

Claims20

Dependent claims

A package structure, comprising:

an interposer comprising a first main surface and a second main surface opposite to the first main surface along a first direction;
a first chip on the first main surface of the interposer, electrically connected to the interposer;
a storage structure on the first main surface of the interposer, electrically connected to the interposer, wherein the storage structure and the first chip are arranged along a second direction perpendicular to the first direction;
and
a second chip on the second main surface of the interposer, electrically connected to the interposer, wherein a projection of the second chip onto the second main surface covers a projection of the first chip onto the second main surface and a projection of the storage structure onto the second main surface.

2 more elements

A method for forming a package structure, comprising:

forming an interposer, the interposer comprises a first main surface and a second main surface opposite to the first main surface along a first direction;
and
electrically connecting a first chip and a storage structure onto the first main surface of the interposer, and connecting a second chip onto the second main surface of the interposer,
wherein:
the storage structure and the first chip are arranged along a second direction perpendicular to the first direction,
the first chip, the second chip, and the storage structure are all electrically connected to the interposer, and
a projection of the second chip onto the second main surface covers a projection of the first chip onto the second main surface and a projection of the storage structure onto the second main surface.

4 more elements

Dependencies are inferred from the claim text.

Package structure and method for forming the same

Life of this patent

Package structure and method for forming the same

Life of this patent

Abstract

Claims20