Component carrier and method for manufacturing a component carrier
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsJohannes HERK-PICKL, Andreas ZLUC
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Abstract
Provided are component carriers and methods for manufacturing thereof. The component carrier includes a stack having at least one electrically conductive layer structure and a plurality electrically insulating layer structures. The stack has a cavity, and a component is embedded in the cavity and at least one further layer portion is partially filling the cavity. The space between the cavity and the component and/or the at least one further layer portion is filled by resin flowed from one of the plurality of electrically insulating layer structures and/or from the at least one further layer portion.
Claims20
A component carrier comprising:
- a stack comprising at least one electrically conductive layer structure and a plurality of electrically insulating layer structures arranged in a stacking direction, said stack comprising a cavity;
- a component embedded in the cavity;
- and
- at least one further layer portion partially filling the cavity;
- wherein a space between the cavity and component and/or the at least one further layer portion is filled by resin flowed from one of the plurality of electrically insulating layer structures and/or from the at least one further layer portion.
A method of manufacturing a component carrier, the method comprising:
- providing a stack comprising at least one electrically conductive layer structure and a plurality electrically insulating layer structures with a cavity in the stack;
- providing a component in the cavity;
- providing at least one further layer portion in the cavity;
- filling the space between the cavity and component and/or the at least one further layer portion by resin flowed from one of the plurality of electrically insulating layer structures and/or from the at least one further layer portion.
Dependencies are inferred from the claim text.