Side-by-side integrated device package with wirebond interconnects

Abstract

A device that includes a first substrate that includes a first set of conductors. The first set of conductors define first contacts for a first die and first conductive interconnects to route signals associated with the first die. The device includes a second substrate that includes a second set of conductors. The second set of conductors define second contacts for a second die and second conductive interconnects to route signals associated with the second die. The device includes a set of wirebond interconnects electrically coupled to the first set of conductors and the second set of conductors. The device includes mold compound that at least partially encapsulates the first substrate, the second substrate, and the set of wirebond interconnects. The mold compound is configured to retain the first substrate and the second substrate in position relative to one another in a side-by-side configuration.

Dependencies are inferred from the claim text.