Semiconductor devices and methods of manufacturing semiconductor devices
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorKi Yeul Yang
Life of this patent
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Abstract
In one example, an electronic device can include a first electronic component and a second electronic component adjacent the first electronic component. A buffer block can be disposed between the first electronic component and the second electronic component. An encapsulant can be disposed on the first electronic component, the second electronic component, and the buffer block. A side of the buffer block can be substantially flat and coplanar with a side of the encapsulant. A redistribution structure can be disposed over the side of the encapsulant and the side of the buffer block. Other examples and related methods are also disclosed herein.
Claims20
An electronic device, comprising:
- a first electronic component;
- a second electronic component adjacent the first electronic component;
- a buffer block disposed between the first electronic component and the second electronic component;
- an encapsulant disposed on the first electronic component, disposed on the second electronic component, and bounding lateral sides of the buffer block over the first electronic component and over the second electronic component, wherein a side of the buffer block is flatter than a side of the encapsulant that is substantially coplanar with the side of the buffer block;
- and
- a redistribution structure disposed on the side of the encapsulant and the side of the buffer block that is substantially coplanar with the encapsulant.
An electronic device, comprising:
- an electronic component;
- a buffer block coupled to the electronic component;
- an encapsulant disposed on the electronic component and the buffer block, wherein a first filler material of the encapsulant has a greater size than a second filler material of the buffer block, wherein the encapsulant bounds a lateral side of the buffer block over the electronic component;
- and
- a redistribution structure disposed on a side of the encapsulant and a side of the buffer block, wherein the side of the buffer block is flatter than the side of the encapsulant.
A method of making an electronic device, comprising:
- placing a first electronic component adjacent a second electronic component on a carrier;
- providing a buffer block between the first electronic component and the second electronic component;
- providing an encapsulant over the first electronic component, the second electronic component, and the buffer block, wherein the buffer block comprises a first dielectric material and the encapsulant comprises a second dielectric material different from the first dielectric material, wherein the encapsulant bounds lateral sides of the buffer block over the first electronic component and over the second electronic component;
- and
- providing a redistribution structure on a side of the encapsulant and a side of the buffer block.
Dependencies are inferred from the claim text.