Multichip integrated circuit modules

Multichip integrated circuit package comprising:

• a circuit component, said component having an upper surface with at least one interconnection pad thereon;
• a substrate having an upper surface and a lower surface, said substrate including a hole therein extending from said upper substrate surface to said lower substrate surface, said substrate hole being sized to accommodate said circuit component therein;
• at least one integrated circuit chip disposed above said substrate's upper surface, said integrated circuit chip having at least one interconnection pad on a top surface thereof, the top surface of said at least one integrated circuit chip being in a plane substantially parallel to said substrate's upper surface, said integrated circuit chip also having at least one side surface;
• said component being positioned within said substrate hole such that said component's upper surface is substantially parallel to said substrate's upper surface;
• an encapsulant surrounding said at least one integrated circuit chip including said top surface and said at least one side surface thereof, and contacting at least the upper surface of said circuit component, said encapsulant having an upper surface above the tops of the integrated circuit chip and the circuit component and having a plurality of via openings therein, said openings being aligned with at least some of said chip and component interconnection pads;
• and
• a pattern of interconnection conductors disposed above the upper surface of said encapsulant so as to extend between at least some of said openings and so as to provide electrical connection to at least some of said interconnection pads through said openings.

A multichip integrated circuit package comprising:

• a substrate having an upper surface and a lower surface, said substrate having a well disposed on the lower surface thereof, said well being sized to accommodate a circuit component such that said component resides entirely within said substrate well;
• at least one integrated circuit chip disposed above said substrate's upper surface, said integrated circuit chip having at least one interconnection pad on a top surface thereof, the top surface of said at least one integrated circuit chip being in a plane substantially parallel to said substrate's upper surface, said integrated circuit chip also having at least one side surface;
• means for electrically coupling a circuit component disposed within said substrate well with the upper surface of said substrate;
• an encapsulant surrounding said at least one integrated circuit chip including said top surface and said at least one side surface thereof, and the upper surface of said substrate, said encapsulant having an upper surface above the top of said integrated circuit chip and having a plurality of via openings therein, said openings being aligned with at least some of said chip interconnection pads and said electrical means for coupling said circuit component disposed within said well to the upper surface of said substrate;
• and
• a pattern of interconnection conductors disposed above the upper surface of said encapsulant so as to extend between at least some of said openings and so as to provide electrical connection through said openings to at least some of said interconnection pads and said circuit component disposed within said well.

A hermetically packaged multichip integrated circuit module comprising:

• a multichip module including:
• a substrate having an upper surface;
• a plurality of unpackaged integrated circuit chips disposed above said substrate's upper surface, said integrated circuit chips each being spaced apart from the other of said integrated circuit chips and each having at least one interconnection pad on a top surface thereof, the top surfaces of said integrated circuit chips being in a plane substantially parallel to said substrate's upper surface, said integrated circuit chips also each having at least one side surface;
• an encapsulant surrounding said integrated circuit chips including said top surfaces and said at least one side surfaces thereof and completely filling all space between adjacent integrated circuit chips disposed above said substrate's upper surface, said encapsulant having an upper surface above the tops of the integrated circuit chips and having a plurality of via openings therein, said openings being aligned with at least some of said interconnection pads;
• and
• a pattern of interconnection conductors disposed within at least some of said plurality of via openings and above the upper surface of said encapsulant so as to extend between said at least some of said plurality of via openings, and so as to provide direct electrical connection to at least some of said interconnection pads through said openings wherein a unitary module having multiple directly interconnected integrated circuit chip is produced, said pattern of interconnection conductors including at least one connection pad;
• a lid including an electrically insulating cover plate having a plurality of openings therethrough;
• conductive plugs hermetically disposed within said cover plate openings;
• means for electrically connecting at least one of said conductive plugs of said cover plate with at least one of said connection pads of said pattern of interconnection conductors;
• and
• means for hermetically sealing said lid about said single multichip module with said at least one conductive plug in electrical contact with said at least one connection pad of said pattern of interconnection conductors.

A hermetically packaged multichip integrated circuit module comprising:

• a multichip module including:
• a substrate having an upper surface;
• a plurality of unpackaged integrated circuit chips disposed above said substrate's upper surface, said integrated circuit chips each being spaced apart from the other of said integrated circuit chips and each having at least one interconnection pad on a top surface thereof, the top surfaces of said integrated circuit chips being in a plane substantially parallel to said substrate's upper surface, said integrated circuit chips also each having at least one side surface;
• an encapsulant surrounding said integrated circuit chips including said top surfaces and said at least one side surfaces thereof and completely filling all space between adjacent integrated circuit chips disposed above said substrate's upper surface, said encapsulant having an upper surface above the tops of the integrated circuit chips and having a plurality of via openings therein, said openings being aligned with at least some of said interconnection pads;
• and
• a pattern of interconnection conductors disposed within at least some of said plurality of via openings and above the upper surface of said encapsulant so as to extend between said at least some of said plurality of via openings and so as to provide direct electrical connection to at least some of said interconnection pads through said openings wherein a unitary module having multiple directly interconnected integrated circuit chips is produced, said pattern of interconnection conductors including at least one connection pad;
• a lid including an electrically insulating cover plate having a plurality of openings extending therethrough, said cover plate openings each being aligned with a connection pad on said pattern of interconnection conductors;
• conductive means hermetically disposed within each of said cover plate openings, at least one of said conductive means being in electrical contact with one of said connection pads of said pattern of interconnection conductors;
• and
• means for hermetically sealing said lid about said multichip module with said at least one conductive means in electrical contact with said connection pads of said pattern of interconnection conductors.