Package with integrated voltage regulator and method forming the same

A structure comprising:

• a first redistribution structure;
• a first die coupled to the first redistribution structure;
• a package substrate coupled to the first redistribution structure, wherein the first die is disposed between the package substrate and the first redistribution structure, the package substrate comprising:
• a core;
• a first routing structure on a top surface of the core;
• a second routing structure on a bottom surface of the core;
• and
• an inductor comprising;
• a first through-via extending through the core;
• and
• a coil structure embedded in the second routing structure, wherein the coil structure is electrically connected to the first die through the first through-via, the first routing structure, and the first redistribution structure, wherein the first die is an integrated voltage regulator die, and wherein the first die overlaps the coil structure and the first through-via.

A structure comprising:

• a first die over and electrically connected to a first redistribution structure, wherein the first die is embedded in an encapsulant;
• a second die below and electrically connected to the first redistribution structure;
• an inductor disposed over the first redistribution structure, wherein the inductor is embedded in the encapsulant, wherein the inductor comprises:
• a first conductive via;
• and
• a first magnetic material disposed on sidewalls of the first conductive via;
• and
• a second redistribution structure over and electrically coupled to the first die, wherein the first magnetic material is in physical contact with the first redistribution structure and the second redistribution structure.